Discover How System-in-Package (SiP) Technology is Transforming Modern Electronics
Explore one (or both) customer case studies today!
Integrating the TI AM335x
Key Benefits Covered in the Case Study:
- Delivered superior technical performance with a complete processing subsystem featuring ultra-low 3ms latency and ample memory storage in a single package
- Reduced design complexity through simplified PCB requirements and open-source tools, making the project feasible for a team with limited engineering experience
- Enabled rapid prototyping and streamlined production with 60% smaller footprint, flexible sourcing options, and simplified bill of materials
- Provided crucial technical support through Hardware Design Review service and integration guidance, helping transition from prototype to market-ready product
- Accelerated time-to-market by bypassing typical development challenges, allowing the startup to successfully compete with established industry players
Integrating the STM32MP1
Key Benefits Covered in the Case Study:
- Dramatic time savings - reduced hardware development from 18 months to just 3 months while eliminating multiple prototype iterations
- Compact integration - complete processing subsystem in an 18mm x 18mm BGA package that integrates DRAM, power management, oscillator and 100+ components in 1/6th the space
- Superior development experience - high-quality SDK and clean software architecture that accelerated software integration by 6 months
- Market advantage - enabled first-to-market position, rapid scaling to 300+ customers, and helped secure additional funding
- Design flexibility - simplified hardware integration and PCB design while offering both commercial and industrial-grade options to serve different markets cost-effectively