This joint webinar with Witekio originally aired in January 2024.
Erik's portion of the webinar is 23 minutes.
Bypass engineering slow downs with system-in-package design simplification. A recent Octavo Systems customer just shaved 9-months off their design timeline!
End consumers are eager for smaller, more powerful electronic products. System-in-Package can reduce the size of the subsystem by more than 50%.
SiP will reduce the overall cost of the product for its entire life, especially when compared to other design options.
By creating SiP devices we are allowing the idea behind Moore’s law to continue, delivering more integration and more performance in an easy to use formfactor, allowing you to focus on what differentiates your product.
The OSD32MP15x module is the first System in Package based on the STMicroelectronics STM32MP1.
The OSDZU3 is the fastest and most flexible way to develop a system around the AMD Zynq® UltraScale+™ MPSoC.
The new OSD62x SiP family of devices empowers designers utilizing the Texas Instruments AM62x processors.