Learn How to Implement IPCC with a Real-Time Balance Ball Game

Master the art of interprocessor communication between Linux and real-time operations on the STM32MP1’s dual-core architecture. 

Sign up today to receive a full wiring diagram, source code, and a step-by-step guide.

Sign up now for free to unlock everything you need to complete this fun, educational demo.

The demo is straightforward and includes:

  1. Full wiring diagram
  2. Source code
  3. IPCC overview and Step-by-step guide

Get to market faster.

Bypass engineering slow downs with system-in-package design simplification. A recent Octavo Systems customer just shaved 9-months off their design timeline!

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Reduce the size of your design.

End consumers are eager for smaller, more powerful electronic products. System-in-Package can reduce the size of the subsystem by more than 50%.

Save money.

SiP will reduce the overall cost of the product for its entire life, especially when compared to other design options.

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We're on a mission to revolutionize electronics with cutting-edge System-in-Package Technology. 

By creating SiP devices we are allowing the idea behind Moore’s law to continue, delivering more integration and more performance in an easy to use formfactor, allowing you to focus on what differentiates your product. 

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OSD32MP15x

The OSD32MP15x module is the first System in Package based on the STMicroelectronics STM32MP1.

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OSDZU3

The OSDZU3 is the fastest and most flexible way to develop a system around the AMD Zynq® UltraScale+™ MPSoC.

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OSD62x

The new OSD62x SiP family of devices empowers designers utilizing the Texas Instruments AM62x processors.

Learn How to Implement IPCC with a Real-Time Balance Ball Game

Sign up now for free to unlock everything you need to complete this fun, educational demo.

The demo is straightforward and includes:

  1. Full wiring diagram
  2. Source code
  3. IPCC overview and Step-by-step guide