Learn how System-in-Package (SiP) technology can upgrade your design project!

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We're on a mission to revolutionize electronics with cutting-edge System-in-Package Technology. 

By creating SiP devices we are allowing the idea behind Moore’s law to continue, delivering more integration and more performance in an easy to use formfactor, allowing you to focus on what differentiates your product. 

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OSD32MP15x

The OSD32MP15x module is the first System in Package based on the STMicroelectronics STM32MP1.

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OSDZU3

The OSDZU3 is the fastest and most flexible way to develop a system around the AMD Zynq® UltraScale+™ MPSoC.

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OSD62x

The new OSD62x SiP family of devices empowers designers utilizing the Texas Instruments AM62x processors.


Learn how System-in-Package (SiP) technology can upgrade your design project!

Please provide your contact information to unlock the full document.