Octavo Systems OSD32MP1
System-in-Package:
Supercharge your STM32MP1 Designs
Accelerate time-to-market, slash costs, and reduce your footprint.
The OSD32MP15x System-in-Package (SiP) devices deliver all the performance of the STMicroelectronics STM32MP1 microprocessor in a package that feels like a microcontroller and is in the smallest possible footprint.
Get all the details by downloading the OSD32MP15x product overview PDF and learn how SiP can enhance your next design project.
System-in-Package powers the world's best electronic products
Key System-in-Package Benefits
System-in-Package helps you:
- Get to market faster - The first thing a designer will notice when using a System in Package from Octavo Systems is how a design can be simplified, saving significant engineering work, which enables the design to get to market sooner.
- Reduce design size - One of the biggest and most notable advantage of using System in Package is the small size of the integrated subsystem. Since System in Package utilizes Integrated Circuit Manufacturing processes along with bare silicon die, SiP significantly reduces the size of the subsystem when compared to a discrete implementation. All of Octavo Systems SiPs reduce the space required for a system by 50% and some over 60%.
- Save Money - SiP will reduce the overall cost of the product for its entire life, especially when compared to other design options. SiP has benefits that will save money at every stage of a product lifecycle.
Quick statistics
9+
months
On average, engineers save more than nine months in development time.
100+ Components
More than one hundred components in one small package
~1M
Octavo Systems Devices Shipped and counting!
Simplify. Shrink. Accelerate.
System in Package is the next step on the electronics integration path and Octavo Systems can help you take that step.
“The compact SiP made our lives easier as well as providing the computing power and storage we need for performance and scalability, enabling us to develop the idea of the Tone Store that lets users choose their own effects for the pedal. And we are still nowhere near the limit of what we can do with it.”
Download the datasheet to learn more
Get all the technical details by downloading the OSD32MP15x datasheet and learn how SiP can enhance your next design project.
Get to market faster
Bypass engineering slow downs with system-in-package design simplification. A recent Octavo Systems customer just shaved 9-months off their design timeline!
Reduce the size of your design
End consumers are eager for smaller, more powerful electronic products. System-in-Package can reduce the size of the subsystem by more than 50%.
Save money
SiP will reduce the overall cost of the product for its entire life, especially when compared to other design options.
Get the guidance you need to level up your next design project!
Conveniently schedule a free consultation to explore your current or future design project. We will connect you with one of our SiP experts.
Download the datasheet to learn more
Get all the technical details by downloading the OSD32MP15x datasheet and learn how SiP can enhance your next design project.